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ENTITY Sōichirō Honda

Sōichirō Honda

PulseAugur coverage of Sōichirō Honda — every cluster mentioning Sōichirō Honda across labs, papers, and developer communities, ranked by signal.

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  1. SIGNIFICANT · CL_10366 ·

    TSMC advances 3D chip stacking roadmap with finer pitches for future CPUs

    TSMC has revealed its roadmap for System-on-Integrated-Chips (SoIC) 3D stacking technology, aiming to reduce pitch sizes from 6 microns to 4.5 microns by 2029. This advancement will enable face-to-face chiplet stacking,…