Let’s focus on the first for now; Assembly.
Semiconductor packaging companies like ASE and Amkor are shifting from low-margin, commoditized assembly to high-margin advanced packaging crucial for AI and HPC applications. This strategic move involves significant investment in advanced packaging technologies like CoWoS, while legacy wire bonding capacity is increasingly concentrated in China. Despite weak demand in PCs and smartphones, China is experiencing a surge in demand for wire bonders, indicating a structural shift in the industry. AI
IMPACT Advanced packaging is critical for scaling AI and HPC, indicating a supply chain shift to meet future demand.